PEEK Carbon Fiber Bone External Fixator bracket
Product Details
With the development of communication, the energy loss has gradually increased. Up to now, due to the large increase in transmission speed, the energy loss has also increased sharply, and the heat generation has also increased. Therefore, the heat dissipation performance of the device is also higher. Heat dissipation has become a major issue for 5G equipment. | |
![]() It is understood that the power consumption of 5G base stations is 2.5 to 4 times the power consumption of 4G base stations, which will inevitably increase the heat generation of base stations. Common heat sink parts are metal die-cast heat sinks, but the metal is heavy and not insulated, the process is complex, and the processing accuracy is high , Poor corrosion resistance. For the purpose of weight reduction and cost reduction, the requirements for heat dissipation materials are higher, materials with lower density, better thermal conductivity, and strong corrosion resistance are needed. |
In addition to base stations, the heat dissipation of electronic devices such as mobile phones, laptops, and tablet computers is also the focus of everyone's attention. The more and more electronic devices implement functions, the more power they consume and the more serious the heat generation. At the same time, the limited space design places higher requirements on heat dissipation. In the future 5G thousand yuan market, plastic casings may usher in an explosion, but we all know that ordinary plastic casings have poor thermal conductivity and cannot radiate the heat generated inside the terminal equipment in a timely manner, which will affect the performance of the equipment.Thermally conductive plastics use thermally conductive fillers to uniformly fill polymer matrix materials to improve their thermal conductivity |
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